Share the QR code < / P > < p > with friends and circles of friends < / P > < p > [text / observer network Lv Dong] < / P > < p > < / P > < p > on December 5, Taiwan's economic daily and Lianhe News reported that the first wafer level sealing and testing plant of Foxconn Group officially put into operation in Qingdao on November 26 introduced up to 46 lithography machines produced by Shanghai microelectronics, It also said that this means that the lithography machines produced in mainland China have achieved a leap from 90nm to 28nm < p > after verification by observer.com, it is found that the semiconductor sealing and testing project jointly established by Foxconn and Qingdao state-owned assets has begun to introduce Shanghai microelectronics lithography machine in July this year. However, the Taiwan media confused the front channel manufacturing lithography machine with the back channel packaging lithography machine. The lithography machine used in the Qingdao sealing and testing project belongs to the packaging lithography machine and is not used for chip manufacturing < p > a senior person in the semiconductor industry told observer.com that the traditional packaging process does not use a lithography machine, and only wafer level advanced packaging will use a lithography machine. Compared with the lithography machine for IC manufacturing, the research and development of the lithography machine for packaging is much less difficult and the market space is smaller, but the later lithography machine manufacturers can accumulate in the packaging field first < p > according to Foxconn's official wechat news, on the morning of November 26, the commissioning ceremony of Foxconn semiconductor high-end sealing and testing project was held in Qingdao West Coast new area. With the start of the first wafer level packaging and testing production line, the project has entered the production and operation stage. It is expected that about 30000 wafer chips will be sealed and tested every month after the project is completed < p > in April 2020, Qingdao West Coast new area signed a contract with Foxconn to set up a high-end semiconductor sealing and testing project. The main body of the project is Qingdao new core technology Co., Ltd. (hereinafter referred to as new core technology), with a registered capital of 508 million yuan < p > qixinbao information shows that new core technology is currently held by Qingdao financial control technology service company, which is indirectly controlled by Qingdao state-owned assets, with a shareholding of about 46.85%; Foxconn's affiliated enterprise Hongjing technology holds about 15.75% and its Shenzhen futaihua industry holds about 11.81%; Chen Weiming, general manager of Foxconn s business group, served as the chairman < p > in July 2020, the construction of the new nuclear core technology sealing and testing project will be started, and the main body of the project will be capped and the internal decoration will be started in December; The installation ceremony was held in July 2021, and the equipment began to be installed and commissioned, and mass production was realized in December; It took only 17 months from commencement to mass production, creating a miracle of factory construction in the same industry. It can't help but remind people that Gou painted trump a cake in the United States for more than three years and didn't fulfill it when trump stepped down < p > on December 3 this year, new core technology posted on its official website that the company held the entry ceremony of the first lithography machine in July this year. The article points out that the lithography machine is the key equipment of the semiconductor industry packaging plant and wafer plant. In the rapidly changing world situation, the new core adopts the domestic lithography machine to ensure the stable production and improve the production capacity < p > field pictures show that the first packaging lithography machine of new core technology was indeed produced by Shanghai microelectronics, but the total number of equipment and specific technical details were not disclosed < p > then, on December 5, Lianhe news network and other Taiwan media reported that Foxconn Group's first wafer level packaging and testing plant officially put into operation in Qingdao introduced up to 46 28nm lithographies of Shanghai microelectronics. It is reported that the lithography machine completed technical testing and certification in August, which means that the lithography machine of Shanghai microelectronics has achieved a leap from 90nm to 28nm < p > the observer website inquired the official website of Shanghai microelectronics and found that the company's lithography products are divided into 600 series lithography machines for IC front channel manufacturing and 500 Series lithography machines for IC rear channel advanced packaging. Among them, the resolution of ssa600 / 20, the latest model of 600 series lithography machine, is 90nm, while the minimum resolution of 500 Series lithography machine is 1 μ m。 < p > obviously, the Taiwan media confused the manufacturing lithography machine with the advanced packaging lithography machine < p > in the field of packaging lithography, Shanghai microelectronics has made a breakthrough for a long time < p > according to a research report of Founder Securities in June 2020, Shanghai microelectronics has achieved mass supply in the field of packaging lithography. It is the main supplier of many leading packaging and testing enterprises (rimoonlight, Tongfu micro electronics, Changdian technology, etc.), and the domestic packaging lithography market share is as high as 80%. Not only in the domestic market, Shanghai microelectronics packaging lithography machines are also exported to overseas markets, with a share of 40% in the global market < p > in September this year, Shanghai microelectronics announced the launch of a new generation of large field of view high-resolution advanced packaging lithography machine. According to the company, the new lithography machine launched this time is mainly used in the field of high-density heterogeneous integration. It has the characteristics of high resolution, high lithography accuracy and large exposure field of view, which can help wafer level advanced packaging enterprises realize the application of multi chip high-density interconnection packaging technology < p > however, in the manufacturing field, the gap between Shanghai microelectronics and foreign lithography giants such as asmai is very obvious < p > Fang Zheng Securities pointed out that due to the most complex and difficult ic front-end lithography technology, the demand and value are the highest among all lithography machines. At present, there is a big gap between China and foreign advanced levels such as asmai in the Netherlands < p > in terms of market space, there is also a large gap between manufacturing lithography and packaging lithography. According to the statistical data of yole, the market of advanced packaging lithography equipment will reach US $1 billion in 2020. From 2020 to 2026, the packaging lithography equipment market will grow to US $1.7 billion at an average annual rate of 9%. In 2020, the market space of the whole lithography machine will be about US $13.5 billion < p > from a global perspective, ASML, Nikon and Canon have long controlled the semiconductor front-end lithography machine. From the proportion of global semiconductor front-end lithography machine shipments in the calendar years 2012-2019, ASML, Nikon and Canon have almost 99% of the market share, of which the market share of ASML lithography machine is more than 60% all year round, and the market position is very stable < p > founder securities mentioned that the import substitution of lithography machines can not be completed by a single enterprise, and the top enterprises in the lithography industry chain need to cooperate with each other. The lithography industry chain can be divided into two parts: one is the core components of the lithography machine, including key subsystems such as light source, objective lens, double workbench and immersion system; the other is the lithography supporting facilities, including photoresist, photomask plate, glue coating and development equipment, etc < p > the analyst of cinno research, a market research institution, pointed out to the observer that the information learned at present is that the light source and objective lens are the most influential parts of the R & D difficulties of domestic lithography machines, respectively from Keyi Hongyuan and Guowang optics in Beijing. Among them, the objective lens is the most difficult. There is still a gap between Germany and Japan in the accumulation of many years of technical experience, so it is not easy to catch up in a short time. In addition, in order to improve the degree of autonomy of subsystems and parts, counter ?
2023-03-22 10:04:47